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Opto-Mechanics and Physical Reliability Lab

External Projects
  1. 01/15–06/15, Electronic interconnect reliability under multiple loading conditions, Universal Instruments.
  2. 11/14–06/15, Deflection and Strain Response Measurement of Corning Gorilla Glass during Ball Drop, Corning.
  3. 07/14–06/15, Joint Research in Digital Imaging Correlation and Applications, Advanced Semiconductor Engineering.
  4. 07/14–07/15, Investigating Temperature and Time Dependent Stress Relaxation Behavior of MEMS Packages and Packaging Materials, Analog Device, Inc.
  5. 01/14–12/14, Electronic Assembly Vibration Testing, Interconnect Failure Detection, and Finite Element Modeling, Universal Instruments.
  6. 01/14–12/14, An Optimization Study of Multiple Gantry Surface Mount Placement Machines, Samsung Techwin.
  7. 08/13–07/14, Advanced Package and Material Research, Analog Device, Inc.
  8. 04/13–03/14, Large Format Digital Correlation Metrology System, simulation & modeling and their Application to Electronic Components including Wafers, Advanced Semiconductor Engineering.
  9. 09/13–12/13, Advanced Package and Material Research, Analog Device, Inc.
  10. 06/12–04/13, Abnormal Signal for MEMS Oscillator, Sand 9.
  11. 06/12–04/13, Advanced Package and Material Research, Analog Device, Inc.
  12. 06/12–04/13, Chip-Package Interactions on 3D-IC Learning Vehicle, SEMATECH.
  13. 06/12–12/12, Underfill and Thermal Management, SEMATECH.
  14. 05/12–12/12, Investigations on Direct Copper Bonding as Method of Interconnection for Multi-Tier Chip / Wafer Stacking, SEMATECH.
  15. 11/10–03/12, Impact Response of Glass Substrate, Corning.
  16. 10/10–11/11, Investigating Temperature and Time Dependent Stress Relaxation Behavior of MEMS Packages and Packaging Materials, Analog Device, Inc.
  17. 02/09–01/10, Viscoplastic Material Characterization for MEMS, Analog Device, Inc.
  18. 02/08–11/08, Development of In-situ and Full-field Deformation Analysis Methodology for a Mobile Phone under Drop Shock, Samsung.
  19. 02/09–01/10, Viscoplastic Material Characterization for MEMS, Analog Device, Inc.
  20. 02/08–11/08, Development of In-situ and Full-field Deformation Analysis Methodology for a Mobile Phone under Drop Shock, Samsung.
  21. 02/09–01/10, Viscoplastic Material Characterization for MEMS, Analog Device, Inc.
  22. 06/06–03/07, Development of an Automated, In-situ, and 3-D Nano-Characterization System Using Digital Image Correlation, Intel Corporation.
  23. 05/06–05/07, Modeling Specific Support for Analog Device, Analog Device, Inc.
  24. 02/06–11/06, Development of In-situ and Full-field Deformation Analysis Methodology for a Mobile Phone under Drop Shock, Samsung Electronics.
  25. 08/04-11/05, Fiber Coating with Low Friction Materials, Advanced Design Consulting/ONR.
  26. 05/05-09/06, Design, Packaging, and Reliability Guideline for Safe & Arm, ONR.
  27. 03/05-06/07, Aircraft Structural Integrity Program, Boeing.
  28. 01/05-12/05, Design Guidelines for Multiple Stack Packages, Samsung Electronics.
  29. 02/05-05/06, Characterization of MEMS Materials and Evaluation of Thermo-Mechanical Behavior of MEMS Packages, Analog Device, Inc.
  30. 04/04-09/05, 3-D Wafer Level Packaging in Harsh Environments, NASA/Infotonics Center.
  31. 08/05-09/07, Transuranic Aqueous Metal Ion Sensor Systems with Wireless Communication for Discrete Monitoring of Nuclear Materials, National Nuclear Security Administration, DOE.
  32. 08/04-08/07, Mechanical Analysis and Reliability in Microfluidic Device Packaging, Xerox Corp.
  33. 03/05-06/06, Warpage Analysis of the PBGA Packages, Multiple Sponsors.
  34. 05/04-12/04, Reliability Analysis of a Micro BGA Interconnect, Universal Instruments.
  35. 01/04-12/04, Reliability Impact of the Power Cycling, Samsung Electronics.


Internal Projects
  1. 07/14–06/15, Design Guideline of 3D Packaging, IEEC.
  2. 07/13–06/14, Through Glass Via (TGV) Interposer Reliability Testing, IEEC.
  3. 07/12–06/13, Through Glass Via (TGV) Interposer Reliability Testing, IEEC.
  4. 07/11–06/12, Universal TGV Reliability Test Vehicle Using a Glass Interposer and Glass Chips, IEEC.
  5. 07/10–06/11, Low-k Flip Chip Package Chip-Package Interaction, IEEC.
  6. 07/09–06/10, Characterization of CZT Crystal Strength and Measurement of Processing and Packaging Stress for the micro Interconnect, IEEC.
  7. 07/08–06/09, Investigation of Chip-Package Interaction for Flip Chip Solder and low-k Layer, IEEC.
  8. 07/07–06/08, Predictive Model of Moisture Behavior and Its Reliability Impact on Microelectronics and MEMS - Crack Growth Model during Reflow and Reliability Testing, IEEC.
  9. 01/07–12/07, Membrane Wrinkling Analysis for Flexible Electronics, CAMM.
  10. 03/06–11/06, Probe Pin Wear-out Analysis of Sn Pad, Analog Devices/IEEC.
  11. 05/06–06/07, Understanding the CuOSP on Pb-Free Solder Pads for Drop Impact, StatsChipPAC/IEEC.
  12. 07/06–06/07, Membrane Wrinkling Analysis for Flexible Electronics, CAMM.
  13. 07/06–06/07, Predictive Model of Moisture Behavior and Its Reliability Impact on Plastic Encapsulated Microelectronics and MEMS, IEEC.
  14. 07/05-06/06, Prediction of Electromigration Failure of Various Pb-Free Solder/Pad Combinations, IEEC.
  15. 07/04-06/05, Development of a High-Sensitivity Three Dimensional In-Situ Measurement Tool for Small Scale Devices and Packages, IEEC.
  16. 07/04-06/05, Mechanical Shock/Drop Performance of Packaging Interconnects: Modeling and Measurement, IEEC.
  17. 07/03-06/04, Development of Higher Sensitivity Infra-Red Fizeau Interferometer (IRFI) for Real-Time Out-of-Plane Deformation Measurement, IEEC.
  18. 10/02-12/03, Enhancement of Adhesion for Diffraction Grating, Photomechanics/Strategic Partnership for Industrial Resurgence (SPIR)

The Integrated Electronics Engineering Center (IEEC), Binghamton University

The Center for Advanced Microelectronics Manufacturing (CAMM)
Binghamton University State University of New York
PO BOX 6000 Binghamton, NY 13902-6000
© 2010 Binghamton University

Last Updated: 1/28/2017