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Opto-Mechanics and Physical Reliability Lab

Current Members

 

Faculty


Dr. Seungbae Park (CV)
Department Page

 

Students

Karthik Deo Ph.D.Student
Junbo Yang Ph.D. Student
Dalei Yang Ph.D. Student
Kewei Shou Ph.D. Student

 

Former Members

Faculty


Dr. John HC Lee
Retired (2011)

 

Graduates

Graduates of the Opto-Mechanics and Physical Reliability Lab are employed by the top companies in industry such as Amazon, Apple, Corning, Intel, Micron, Microsoft, and Samsung, etc. Our students also receive internship oppptunity from those top companies.

Izhar Ahmed M.S., 2004 Apple Inc.
Ganesh Iyer M.S., 2004 Cisco
Rahul Joshi M.S., 2004 Hewlett-Packard
Karthik Raghunathan M.S., 2005 Corning
Chirag Shah M.S., 2007 Apple Inc.
Aaron Reichman M.S., 2007 Intel Corp.
Khalid Umar M.S., 2007 Raytheon
Kyung-Taik Park M.S., 2008 Korea
Hyojeong Jeon M.S., 2009 Lecturer in College Prep School
Dong Gun Lee M.S., 2009 Korea Inst. Of Machinery
Claire R. Coble M.S., 2013 Corning
Quang H. Nguyen M.S., 2013 Micron
Rohit V. Bhosle M.S., 2013 DePuy Synthes, part of the Johnson & Johnson family of companies
Jung Hoon Baek M.S., 2016 Korean Air Force
Zhenming Tang Ph.D., 2008 Google
Thesis: Interfacial reliability of lead-free flip-chip BGA package
Ramji Dhakal Ph.D., 2009 Microsoft
Thesis: Microstructure based experimental and finite element analysis of failure mechanism of lead-free BGA interconnects
Hongchul Lee Ph.D., 2010 Aero Tech. Res. Inst., Korean Airforce
Thesis: Advanced aircraft service life monitoring method via flight-by-flight load spectra
Abdullah Al-Yafawi Ph.D., 2010 Cobham Mission Systems
Thesis: Electronic packages fatigue life predicion under random vibration loading conditions
Tung T. Nguyen Ph.D., 2010 Microsoft
Thesis: Characterization of the elasto-plastic behavior of actual tin silver copper solder joints using DIC
Jae B. Kwak Ph.D., 2010 Samsung
Thesis: Experimental assessment of electronic package deformation using optical full-field deformation measurement system
Haojun Zhang Ph.D., 2010 GlobalFoundries
Thesis: Investigation of hygroscopic swelling behavior of molding compound and its impact on encapsulated MEMS packages
Dongmyung Suh Ph.D., 2011 Pacific Northwest National Lab
Thesis: Numerical modeling transport phenomena in proton exchange membrane fuel cells
Hoyong Lee Ph.D., 2012 L. Colonel, Korean Airforce
Thesis: Avionics reliability assurance guidelines for high altitude applications
Da Yu Ph.D., 2012 Apple Inc.
Thesis: Fatigue life assessment and prediction of ball grid array package under environmental conditions
Seil Baek Ph.D., 2012 L. Colonel, Korean Airforce
Thesis: Flight-by-flight stress spectrum development methodology for aircraft structural life assessmentns
Yeonsung Kim Ph.D., 2014 Qualcomm
Thesis: Stress and deformation minimization of MEMS sensor package and TSV interposer package
Liang Xue Ph.D., 2014 Google
Thesis: Dynamic behavior of a tempered glass under impact
Dapeng Liu Ph.D., 2015 Microsoft
Thesis: Packaging-induced stresses on microelectromechanical systems
HoHyung Lee Ph.D., 2016 Apple Inc.
Thesis: Investigation of the time dependent property for packaging materials
Yuling Niu Ph.D., 2017 Qualcomm
Thesis: The Development of Digital Image Correlation Method for Electronic Packaging Reliability Assessment
Ah-Young Park Ph.D., 2017 Corning
Thesis: Thermo-mechanical problems and their solution in a 3D micro-electronics package using Cu-to-Cu direct bonding
Charandeep Singh Ph.D., 2018 Corning
Thesis: Dynamic Fracture of Brittle Materials
Jing Wang Ph.D., 2018 Apple Inc.
Thesis: A Study on Thermal and Moisture Impacts on Reliability of Electronic Packaging
Shuai Shao Ph.D., 2018 AMD
Thesis: Fast Prediction for Board-level Reliability of Interconnect in Electronic Packaging
Huayan "Andy" Wang Ph.D. 2019 Apple Inc.
Thesis: Advances of 2D Micro Digital Image Correlation and Its Usage in Chip Packaging Interaction Analysis
Van Lai Pham Ph.D. 2020 Samsung
Thesis: Plastic strain analysis and reliability study of BGA solder joint with Digital Image Correlation technique
Ruiyang Liu Ph.D. 2020 Apple Inc.
Thesis: Aging of Polymer Materials and Its Reliability Impacts to 2.5D Electronics Packaging
Jiefeng Xu Ph.D. 2020 Apple Inc.
Thesis: Electromigration Assessment and Prediction in 2nd Level Ball Grid Array
Ke Pan Ph.D. 2022 Apple Inc.
Thesis: Thermomechanical Reliability and Constitutive Investigation of Copper Through-Glass Via in Glass Interposer
Chongyang Cai Ph.D. 2022 Intel
Thesis: Evaluation of Reliability of Low Melting Temperature Sn-Bi Solder
Pengcheng Yin Ph.D. 2024 AMD
Thesis: Evaluation Airborne Drop Survivability of Electronic Packages
Jong Hwan Ha Ph.D. 2024 ****
Thesis: Reliability of Differently Shaped Solder Joints in Assemblies of Discrete Components
Yangyang Lai Ph.D. 2024 Intel
Thesis: Machine Learning Enhanced Reflow Profiling Approach

Post-Doctoral Fellows

Soonwan Chung 2005-2007 Samsung Electronics
Changsoo Jang 2006-2007 Google
Jongman Kim 2006-2007 Samsung Electric
Jia Gao 2005-2006 Cirrus Logic
Shijun Yu 2014 Amazon

The thesis or dissertations of the group members can be found in the ProQuest Digital Dissertations database.



Binghamton University State University of New York
PO BOX 6000 Binghamton, NY 13902-6000

Last Updated: 5/8/2018