Electronics have to endure severe working environment that involves shock and vibration loading. We are working on failure analysis and life prediction using both experimental and numerical techniques.

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Dynamic responses of PCB under product/board-level drop impact
More details at Yu, D. et al., 2010, "Dynamic Responses of PCB under Product-Level Free Drop Impact," Microelectronic Reliability, 50 (7), pp. 1028-1038.

Dynamic Behavior of Thin Glass Panel under Ball Drop Impact
This work received the outstanding poster award from the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013).

Many polymer-based materials are commonly used in electronic packages. In spite of many advantages, most of them, however, are hydrophilic and absorb moisture when exposed to a humid environment. Moisture plays an important role in the integrity and reliability of plastic ectronic packages.

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Study of Temperature Dependent Coefficients of Hygroscopic Swelling of Polymers

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In-situ warpage measurement of 300mm wafer with speckle-free digital image correlation method

Our Digital Image Correlation (DIC) System is capable to measure both in-plane and out-of-plane Deformation induced by thermal loading, mechanical loading, and hygroscopic swelling.

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3D and 2D Deformation Measurements using Digital Image Correlation System


Material Characterization of Actual SAC Solder Joints Using DIC
More details at Nguyen, T. et al., 2011, "Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation," J. Electronic Materials, 40 (6), pp. 1-7.

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3D Thermo-Mechanical Simulations of a Copper-to-Copper Direct Bonded 3D TSV Chip Package Interaction Test Vehicle
More details at Park, A.-Y. et al., 2013, "3D Thermo-Mechanical Simulations of a Copper-to-Copper Direct Bonded 3D TSV Chip Package Interaction Test Vehicle," 63rd ECTC.